Multilayer PCB Manufacturing
Custom multilayer PCB fabrication for prototypes and production, with rigid PCB capability up to 68 layers. Choose from FR-4, high-Tg and low-loss material options, with controlled impedance and copper requirements reviewed for your design.
Send your Gerber files, drill data and board requirements to request a quote.
Multilayer PCB Manufacturing Capabilities
Check the available rigid PCB manufacturing range below. Send your drawing and layer requirements so we can confirm a build that matches your design.
| Item | Manufacturing range or option |
|---|---|
| Layer count | Rigid PCB capability up to 68 layers |
| Finished board thickness | 0.4–11.5 mm |
| Minimum inner-layer trace / spacing | 2.5 / 2.5 mil |
| Minimum outer-layer trace / spacing | 3 / 3 mil |
| Minimum mechanical drill | 0.1 mm |
| Material options | FR-4, high-Tg and low-loss material selection |
| Via options | Through, blind and buried vias; HDI structures reviewed against the design |
| Surface finishes | ENIG, lead-free HASL, OSP, immersion silver, immersion tin and ENEPIG |
These limits describe individual capabilities. Available combinations depend on layer count, material, copper, board thickness and via structure.
Which Layer Count Fits Your Design?
Choose the layer count around routing space, signal paths and power distribution. A higher layer count adds options, but it is not required for every design.
| Option | What it gives you | What to include in your enquiry |
|---|---|---|
| 4-layer PCB | Internal power or ground planes with two outer routing layers | Board size, thickness and interface requirements |
| 6-layer PCB | More room for routing and power / ground allocation | Proposed layer order and critical signals |
| 8-layer PCB | Additional routing and reference-plane options for denser layouts | BGA details, impedance targets and via requirements |
| 10 layers and above | More routing channels and power domains for complex boards | Stackup, material, thickness and drill / via data |
Not sure how many layers you need? Send your proposed stackup and routing requirements for review.
Choose Materials and a Stackup for Your Application
Your stackup defines the order of the copper layers, the insulation between them and the finished board thickness. It also affects controlled impedance and the space available for routing.
| Material direction | When to consider it |
|---|---|
| FR-4 | General rigid PCB designs |
| High-Tg FR-4 | Designs with higher thermal or assembly requirements |
| Low-loss laminates | High-speed or high-frequency signals where signal loss matters |
If your drawing specifies a material grade, include it with your enquiry. If you are comparing options, tell us the operating conditions, assembly requirements and signal needs.
For controlled impedance, include the target values and the nets or layers that need control. We can review the material and layer construction together with those requirements.
From Your Design Files to the Finished Board
The manufacturing route follows the approved stackup, material and fabrication requirements.
| Step | What happens |
|---|---|
| File and stackup review | Check the board data, layer order, holes and special requirements |
| Inner-layer production | Image and etch the internal copper circuits |
| Lamination | Bond the copper layers and insulating materials into one board |
| Drilling and plating | Create holes and copper connections between the required layers |
| Outer layers and finish | Complete the outer circuits, solder mask and selected surface finish |
| Inspection and testing | Check the board against the inspection and test scope agreed for the order |
What Checks Does Your Project Need?
Include the checks and records you need with your enquiry: electrical testing for open or short circuits, controlled-impedance measurements, dimensional checks, or cross-section reports for internal construction.
Specify the acceptance criteria and reporting requirements before ordering so the quotation covers the requested inspection scope.
Request a Multilayer PCB Quote
Send the files and requirements below so we can review the construction and prepare a quotation.
Files
- Gerber files and NC drill data
- Fabrication drawing and board outline
- Stackup or proposed layer sequence
Board requirements
- Layer count and quantity
- Material grade or material preference
- Finished board thickness
- Inner and outer copper requirements
- Surface finish
- Impedance targets and special vias, if needed
- Testing, reporting and delivery requirements
What Affects the Quote?
Layer count, board size, material, copper, via processing, finish, quantity and the required tests all affect the manufacturing scope. Include these details so the quote reflects the board you need.
If your files are not final, send the preliminary stackup and list the requirements that are still open.
Multilayer PCB FAQs
How many layers can you manufacture?
Our rigid PCB capability extends up to 68 layers. Send your stackup, board size, thickness and drill data for a review of the required construction.
Do I need an eight-layer board?
It depends on the routing space, reference planes, power distribution and component connections your design needs. Compare these requirements with the layer options above.
Can I request controlled impedance?
Yes. Include the impedance targets, relevant nets or layers, and proposed stackup with your files.
Which material should I use?
Start with the thermal, assembly and signal requirements. FR-4, high-Tg and low-loss laminates serve different needs; include a specified grade or tell us what the material must support.
Do multilayer boards always need blind or buried vias?
No. Through vias can connect conventional multilayer constructions. Special via structures are selected when the component layout or interconnect requirements call for them.
Can I get a quote before the design is finished?
Send the preliminary files and identify any open requirements. This helps us distinguish the proposed construction from the final fabrication data.
Technical References
Explore the material and design references below to compare construction options. Ask us to confirm the selected material, processes and delivery requirements for your design.
- Isola 370HR: laminate, prepreg and published material properties
- Altium: 2+N+2 HDI stackup and buildup notation
Send your material grade, construction, applicable standards and acceptance requirements with your enquiry so we can prepare a quotation for your board.