Request PCB / PCBA review
Send the controlled PCB or assembly package, critical-feature list, test specification and record requirements.
View capabilityAssembly & Verification
PCB & PCBA Inspection and Testing
Specify what must be verified, how it will be checked and which records must accompany the order. Bare-board verification, assembly inspection and powered functional testing address different requirements and need separate acceptance instructions.
Capability register
Scope and conditions
Read each value together with its board type and review conditions.
- 100%AOI testing
- Assembly; agreed applicable features and coverage
- 20XMicroscopy
- Corporate inspection entry
- X-rayAnalysis listed
- Feature-specific review
Published limits apply to their stated board type. Layer count, copper weight and minimum geometry require a combined engineering review.
Capability register
Match the verification to the product
The method and deliverables are agreed for the order; a method name does not define complete test coverage.
On smaller screens, scroll within the table to see every column.
| Parameter | Published capability | Applies to | Review conditions |
|---|---|---|---|
| Bare-board electrical verification | Define continuity/isolation requirements | Unassembled PCB | Data revision, netlist basis, acceptance and requested report |
| Board dimensions and features | Drawing-based inspection plan | Outline, holes and critical dimensions | Datums, tolerance, measurement locations and records |
| Impedance verification | Target and coupon plan agreed | Controlled-impedance PCB | Layer/net table, tolerance, coupon construction and report |
| Assembly AOI | 100% AOI testing entry | Assembly inspection list | Agree the applicable features, stages, exceptions and records |
| X-ray analysis | Listed | Hidden-joint or selected assembly review | Package, viewing plan, coverage and acceptance criteria |
| Microscope inspection | Up to 20X | Assembly inspection list | Features, magnification needed and record requirements |
| ICT / FCT | Project-specific confirmation | Assembled-board electrical/functional test | Fixture, access, firmware, test sequence and pass criteria |
Engineering review
Bare-board acceptance starts with the fabrication drawing
Use one revision for data, drawing and test instructions.
- Electrical definition
- Identify the test-data or netlist basis and any intentional connections, isolation requirements or excluded features. State the required record rather than assuming one.
- Physical definition
- Mark critical holes, press-fit interfaces, outline datums, thickness and any local acceptance requirement. Define cross-section locations and criteria if that evidence is required.
- Controlled impedance
- Specify target and tolerance by layer or net group, along with the agreed coupon and reporting method. Keep the construction linked to the acceptance record.
Engineering review
Assembly inspection needs a package-aware plan
Optical and hidden-joint checks should follow the populated design.
Identify polarity-sensitive parts, fine-pitch packages, connectors and features with restricted optical access. Agree how inspection results and any disposition will be recorded.
AOI coverage should be stated against the assembly stage and accessible features. Where X-ray or microscopy is requested, identify the relevant components and acceptance criteria so the quoted scope is measurable.
Engineering review
Define ICT and functional test as a test specification
A powered test requires more than a request to test the board.
- Inputs
- Supply firmware, programming instructions, operating limits, power sequence, interfaces and required fixtures or test-point access.
- Pass criteria
- List measured functions, acceptable results and the required sequence. Identify any calibration or external equipment requirements.
- Traceability
- Define how board identity, firmware revision, test result and retest/rework decisions will be linked in the requested records.
Engineering review
Agree delivery records before production
The requested evidence should correspond to the requirements that drive acceptance.
List the records required with the shipment: for example the agreed electrical test result, impedance report, dimensional record, selected inspection images or functional test log. Their format and scope belong in the quotation and order requirements.
If the design revision or test requirement changes, update the acceptance plan with it. Manufacturing and inspection must refer to the same released files.
Engineering handoff
Prepare an inspection-led RFQ
Attach the product files and describe the required acceptance evidence.
Fine-pitch assembly scope
Check component, board and inspection needs together before placing the assembly order.
View capabilityRFQ checklist
Send the files that define your build
Include the drawing revision and acceptance requirements. The engineering review confirms the manufacturable combination before quotation.
PCB fabrication
- Gerber or ODB++ fabrication data and the board outline
- Layer stackup, material identity, finished copper and board thickness
- Drill data, impedance targets, surface finish and inspection requirements
PCB assembly
- PCB fabrication package and an itemized BOM with manufacturer part numbers
- CPL / pick-and-place data, assembly drawings and component polarity
- Component sourcing scope, programming files and the agreed test procedure
Engineering FAQ
Questions before you quote
Does AOI replace a functional test?
AOI addresses the agreed optical inspection features. Functional acceptance needs a separate test specification, interfaces and pass criteria.
Does X-ray inspection cover every hidden joint automatically?
The package selection, viewing plan, coverage and acceptance criteria are agreed for the project. Specify them in the assembly RFQ.
What should an impedance request include?
Provide target and tolerance, layer/net group, relevant stackup, agreed coupon/test method and the report requirements.
When should I request inspection records?
Include them in the initial RFQ and order requirements so the measurement plan and record format can be agreed before release.