Define HDI by the connections your design requires: which layers each via joins, how the dielectric is built and how the pad will be finished. A layer-by-layer via map is more useful for review than an unsupported HDI order label.
Read each value together with its board type and review conditions.
Published limits apply to their stated board type. Layer count, copper weight and minimum geometry require a combined engineering review.
Drilling figures belong to the stated board type. They do not establish a maximum HDI order or approve a complete stackup.
On smaller screens, scroll within the table to see every column.
| Parameter | Published capability | Applies to | Review conditions |
|---|---|---|---|
| Minimum laser drill | 0.075mm | Rigid and rigid-flex published entries | Dielectric depth, layer span, capture pad and final hole definition |
| Laser aspect ratio | 1:1 | Rigid and rigid-flex published entries | Agree processed depth and diameter; separate from mechanical-hole aspect ratio |
| Flex laser drill | 0.1mm | Flex published entry | Protective construction, dielectric and layer span |
| Blind and buried structures | Listed product type | Rigid published product entry | Supply every start/end layer and the corresponding stackup |
| Filled, capped or stacked features | Construction reviewed from files | Project-defined via structure | Specify fill, cap, plating, stacking and inspection requirements; no universal combination is implied |
Give every via family a distinct name and unambiguous layer span.
These examples describe individual structures in our project reference material. They do not establish a general maximum or guarantee the same combination for a new design.
The reference records 8L any-layer HDI with RO4450F + HTG hybrid pressing, 4.5mil inner hole-to-line and a chip-testing-board description. This documents one construction; it does not establish maximum HDI order.
Individual engineering example; the combination is reviewed for each project.
A separate example records 20L, three pressing cycles, blind connections 1–4 / 17–20L and 3/3mil geometry. The pressing count is a feature of this example.
Individual engineering example; the combination is reviewed for each project.
A via in a component pad needs a more complete instruction than its hole diameter.
Identify which pads contain vias and state the required fill and finished surface. If the drawing requires a cap or stacked structure, show it explicitly so that fabrication, assembly and inspection can review the same requirement.
Define the evidence needed for acceptance, such as the agreed cross-section locations and criteria for the selected construction. Do not use a bare-board inspection statement as a substitute for an assembled-joint inspection plan.
Submit a construction that can be reviewed without guessing the connections.
Include the drawing revision and acceptance requirements. The engineering review confirms the manufacturable combination before quotation.
A universal maximum HDI order is not established in the published capability data. Send the stackup, via spans, pad structure and package geometry for a construction-specific review.
No. It documents one reference structure. Material, dielectric depth, via geometry, filling, stacking and acceptance criteria must be reviewed for each design.
No. The capability table provides separate mechanical and laser entries. Use the processed depth and diameter for the actual hole family.
Identify the affected pads, via size and layer span, required fill/cap, finished surface and the inspection criteria needed by the assembly.