Heavy copper review
Send layer copper, circuit geometry, current-duty and connection requirements.
View capabilityPCB Fabrication
Heavy Copper & Metal-Core PCB Capabilities
Choose the construction by the job it must perform. Heavy copper describes the conductive copper requirement; metal-core describes a board structure with an aluminum or copper base. Define electrical, thermal and mechanical requirements before combining them.
Capability register
Scope and conditions
Read each value together with its board type and review conditions.
- 85ozRigid inner copper
- Rigid-board maximum; inner construction reviewed separately
- 85ozRigid outer copper
- Rigid-board maximum; outer construction reviewed separately
Published limits apply to their stated board type. Layer count, copper weight and minimum geometry require a combined engineering review.
Capability register
Heavy copper: specify the conductive layers
The published 85oz values apply to finished rigid-board copper. They are separate limits and do not transfer to flex or rigid-flex.
On smaller screens, scroll within the table to see every column.
| Parameter | Published capability | Applies to | Review conditions |
|---|---|---|---|
| Maximum finished inner copper | 85oz | Rigid PCB inner layers | State each layer; review spacing, resin fill, stackup and holes |
| Maximum finished outer copper | 85oz | Rigid PCB outer layers | Review finished geometry, plating, mask and assembly interface |
| Layer count boundary | Rigid capability up to 68L | Rigid construction | A maximum layer count is not a promise of 85oz on every layer |
| Fine geometry | Copper-dependent review | Heavy copper patterns | The general rigid minimum trace/space is not automatically available at 85oz |
| Electrical loading | Defined by the design | Current-carrying paths | Supply current duty, allowed temperature rise, connectors and cooling conditions |
Engineering review
Review the complete current path
Copper weight is only one part of the design decision.
- Conductor definition
- Identify current paths, finished copper per layer, widths, clearances and local copper transitions. Flag areas that must retain a defined finished dimension.
- Interconnections
- Show how current crosses layers and enters or exits the board. Identify the relevant plated holes, terminals, press-fit or soldered interfaces.
- Assembly interface
- State pad finish, component attachment and the intended soldering process. Include any local thermal mass or access requirements that affect assembly.
Capability register
Metal-core: define the base and dielectric separately
The capability list includes aluminum/copper metal-based boards. It does not establish one general base thickness, thermal conductivity or dielectric-withstand value.
On smaller screens, scroll within the table to see every column.
| Parameter | Published capability | Applies to | Review conditions |
|---|---|---|---|
| Base material | Aluminum or copper metal-based construction | Listed product family | Specify exact base grade, thickness and mechanical finish |
| Circuit copper | Per approved construction | Conductive circuit layer(s) | Specify copper independently from the metal base |
| Thermal dielectric | Per selected material system | Insulating interface | Supply grade, thickness and thermal-property requirements with test conditions |
| Electrical insulation | Drawing and material specification | Circuit-to-base and mounting interfaces | Define dielectric-withstand and clearance criteria for the application |
| Mechanical thermal interface | Drawing-defined | Mounting surface, holes and outline | Show contact area, flatness/datum needs and attachment details |
Engineering review
Connect the board to the thermal system
Engineering review needs the heat source and the path into the equipment.
Provide a heat-source map or identify the components and areas that drive the thermal requirement. Show the intended cooling interface, mounting method and any electrically isolated regions.
If a material property is mandatory, identify the exact measurement condition or manufacturer documentation that defines it. Copper weight, metal-base thickness and dielectric thermal conductivity are different parameters.
Engineering handoff
Select the review route
Some projects need both routes; keep their specifications separate.
Metal-core review
Send base/dielectric material requirements, heat-source locations and the mounting drawing.
View capabilityRequest engineering review
Attach the full fabrication package and identify which electrical, thermal and mechanical requirements are fixed.
View capabilityRFQ checklist
Send the files that define your build
Include the drawing revision and acceptance requirements. The engineering review confirms the manufacturable combination before quotation.
PCB fabrication
- Gerber or ODB++ fabrication data and the board outline
- Layer stackup, material identity, finished copper and board thickness
- Drill data, impedance targets, surface finish and inspection requirements
PCB assembly
- PCB fabrication package and an itemized BOM with manufacturer part numbers
- CPL / pick-and-place data, assembly drawings and component polarity
- Component sourcing scope, programming files and the agreed test procedure
Engineering FAQ
Questions before you quote
Is 85oz the metal-core thickness?
No. It is the confirmed finished-copper entry for rigid inner and outer layers. Metal-base material and thickness must be specified separately.
Does thicker copper alone establish the allowed current?
No. Supply conductor geometry, duty, allowed temperature rise, connections and cooling conditions so the complete current path can be reviewed.
Is one thermal conductivity or withstand rating available for every metal-core board?
The approved capability sheet does not give a universal value. Define these requirements against the selected dielectric and material documentation.
Can heavy copper and a metal base be combined?
Submit the proposed full construction. The copper, insulation, holes, thermal interface and assembly requirements need to be reviewed together before a combination is accepted.