Megtron PCB Manufacturing for High-Speed, Low-Loss Designs
Build multilayer PCBs around Panasonic MEGTRON materials when signal integrity, transmission loss and thermal reliability are critical. We review the specified material grade, stack-up, impedance, copper profile and fabrication requirements as one engineering package.
What Is a Megtron PCB?
A Megtron PCB is a printed circuit board fabricated with Panasonic Industry's MEGTRON family of high-performance circuit board materials. The family is intended for lead-free, high-layer-count and other performance-sensitive boards, with a dielectric system and smooth copper options designed to reduce transmission loss.
MEGTRON is not a single laminate. Different series and grade variants target different levels of loss, thermal performance and high-speed requirements. For that reason, a purchase specification should identify the exact laminate/prepreg grade instead of only stating “Megtron.”
Where Megtron Adds Value.
The material decision matters most when insertion loss, high-frequency consistency and multilayer reliability become part of the electrical design.
Low Transmission Loss
Low Df and smooth-copper constructions help reduce conductor and dielectric losses in long, fast channels.
High Heat Resistance
MEGTRON 6, 7 and 8 are positioned as highly heat-resistant multilayer materials for demanding fabrication and assembly conditions.
High-Layer-Count & HDI
Selected MEGTRON families support dense interconnect structures and high layer counts used in advanced networking platforms.
Designed for High-Speed Platforms
Typical use cases include routers, switches, servers, optical transmission equipment and other data-intensive electronics.
MEGTRON 6 vs. MEGTRON 7 vs. MEGTRON 8.
Do not choose by series number alone. Use the specified grade, tested frequency, copper profile and complete stack-up to make the engineering decision.
MEGTRON 6
Widely used in ICT infrastructure and other high-speed designs. Panasonic describes it as an industry-standard high-speed, ultra-low-loss PCB material with strong HDI and thermal performance.
- Example laminateR-5775(N)
- Example prepregR-5670(N)
- Typical Dk3.34 @ 13 GHz
- Typical Df0.0037 @ 13 GHz
MEGTRON 7
Targeted at high-speed, large-data-volume equipment such as servers and routers. Panasonic highlights ultra-low Dk/Df and compatibility with very high layer counts and HDI layouts.
- Example laminateR-5785(N)
- Example prepregR-5680(N)
- Typical Dk3.31 @ 14 GHz
- Typical Df0.0023 @ 14 GHz
MEGTRON 8
Developed for next-generation high-speed communication network equipment. Panasonic positions the family for 800GbE. Its published comparison reports about 30% lower transmission loss at 28 GHz for MEGTRON8 R-579Y(U) / R-5795(U) versus MEGTRON7 R-578Y(N) / R-5785(N); this is a manufacturer material comparison, not a guaranteed improvement for a finished PCB. See Panasonic's comparison and conditions.
- Example gradeR-579Y(U) / R-569Y(U)
- Typical Dk3.08 @ 14 GHz
- Typical Df0.0012 @ 14 GHz
- Tg (DMA)220°C
Typical Material Properties for Design Discussion.
Use these values only as a quick comparison. Exact values depend on grade and test method.
| Series / Example Grade | Dk | Df | Tg | Td | Water Absorption | Typical Positioning |
|---|---|---|---|---|---|---|
| MEGTRON 6 R-5775(N) / R-5670(N) | 3.34 @ 13 GHz | 0.0037 @ 13 GHz | 185°C DSC 210°C DMA | 410°C | 0.14% | High-speed ICT, networking, measurement equipment, antenna-related applications |
| MEGTRON 7 R-5785(N) / R-5680(N) | 3.31 @ 14 GHz | 0.0023 @ 14 GHz | 200°C DSC 210°C DMA | 400°C | 0.06% | Servers, routers, 5G-related high-speed and large-data-volume platforms |
| MEGTRON 8 R-579Y(U) / R-569Y(U) | 3.08 @ 14 GHz | 0.0012 @ 14 GHz | 220°C DMA | 370°C | 0.06% | 800GbE and next-generation high-speed networking equipment |
Typical values above are summarized from Panasonic Industry public product information and are not guaranteed production values. Dk/Df cannot be compared responsibly without considering frequency, test method, resin content, glass style and copper roughness. Verify the latest official datasheet for the exact part number used on your PCB.
Electrical test conditions: MEGTRON6 uses 13 GHz (April 2022 sheet); MEGTRON7 uses 14 GHz (July 2024 sheet); MEGTRON8 uses 14 GHz. Panasonic specifies balanced-type circular disk resonance, C-24/23/50, on a 0.75 mm sample. These typical values depend on the glass, resin and copper construction. Sources checked 14 October 2026.
Megtron PCB Design Needs More Than a Material Name.
For high-speed boards, the laminate is only one part of the channel. Resin content, woven-glass construction, copper foil profile, dielectric thickness and trace geometry all influence impedance and insertion loss.
Specify the Exact Part Number
State laminate and prepreg grades where the design has been qualified around a specific construction.
Provide Controlled-Impedance Targets
Include target impedance, tolerance, referenced layers and coupon/test requirements.
Control Copper Profile
Low-profile or very-low-profile copper can materially affect high-frequency conductor loss and should not be treated as interchangeable.
Review Glass Style & Resin Content
Actual dielectric behavior is construction dependent. Core and prepreg choices should be reviewed with the final stack-up.
Plan Via Structures Early
High-layer-count and HDI designs require coordinated decisions on aspect ratio, sequential lamination and reliability.
Connect PCB Data to the Channel Budget
For critical links, review material loss assumptions together with routing length, connector loss and the required signaling architecture.
Focus the Build Around What Changes Electrical Performance.
For low-loss multilayer PCBs, material traceability, stack-up control and finished-board verification deserve explicit acceptance criteria.
Where Megtron PCB Materials Are Commonly Evaluated.
Compare applications by their electrical, thermal and construction requirements, then select the exact MEGTRON grade for your design.
AI Servers & Data Centers
High-speed backplanes, accelerator platforms and dense server interconnects with demanding channel budgets.
Routers & Switches
High-capacity network equipment where insertion loss and dense multilayer routing directly affect link performance.
5G & Telecom Infrastructure
Wireless and transport equipment requiring low-loss multilayer interconnects and stable high-frequency behavior.
Test & Measurement
Semiconductor test equipment, probe-card-related systems and precision high-speed instrumentation.
From Material Callout to Production Stack-Up.
Lock the electrical assumptions before committing the multilayer build.
Share Design Data
Provide Gerber or ODB++, drill data, stack-up, material callout, quantity and controlled-impedance requirements.
Review Material & Stack-Up
Confirm the exact MEGTRON grade, construction, copper profile and any approved alternates before quoting the final build.
Approve Engineering Questions
Resolve DFM items, impedance structures, via architecture and tolerances against the controlled production data set.
Fabricate & Verify
Build to the approved stack-up and complete the agreed inspection, electrical and impedance verification scope.
Send the Stack-Up, Not Just the Board Outline.
For high-speed Megtron designs, complete technical inputs reduce back-and-forth and make the quotation more meaningful.
Gerber/ODB++, drill files, board dimensions, layer count and quantity.
Exact MEGTRON laminate/prepreg grade, or the approved electrical requirements if alternatives may be reviewed.
Impedance targets/tolerances, reference layers, differential pairs and any insertion-loss or test-coupon requirements.
Copper weights, finished thickness, via structures, surface finish and any reliability/test requirements.
Megtron PCB FAQ.
Is MEGTRON a single PCB material?
No. MEGTRON is a family of Panasonic circuit board materials. Different series and grade variants have different dielectric, thermal and processing characteristics, so the exact laminate/prepreg part number should be identified for controlled designs.
What is the difference between MEGTRON 6, 7 and 8?
In broad terms, the later high-performance families target progressively lower transmission loss and higher-speed networking requirements. For example, Panasonic lists MEGTRON 7 R-5785(N) at a typical Df of 0.002 at 12 GHz, while MEGTRON 8 R-579Y(U) is listed at 0.0012 at 14 GHz. Test frequency and method differ, so values should not be compared without context.
Can FR-4 be substituted for Megtron?
Not automatically. If the design was qualified around Megtron's loss, thermal or dimensional behavior, switching to conventional FR-4 can change impedance and channel loss. Any substitution should be evaluated against the electrical and reliability requirements.
Why does copper roughness matter on a Megtron PCB?
At high frequency, current is concentrated near conductor surfaces. Rougher copper increases effective path length and conductor loss, which can reduce the benefit of selecting a low-loss dielectric. Copper profile should therefore be part of the stack-up discussion.
What files are needed for a Megtron PCB quotation?
Provide fabrication data, drill files, layer stack-up, exact material callout, copper requirements, finished thickness, impedance targets, surface finish, quantity and any special inspection/test requirements. For high-speed projects, include the electrical constraints that drove the material selection.
Does specifying “MEGTRON 7” fully define the material?
No. MEGTRON 7 includes multiple grade variants. The laminate and prepreg part number, glass/resin construction and copper profile can matter to the final electrical result. Use the complete approved material specification whenever possible.
Technical references: Panasonic Industry public MEGTRON Series, MEGTRON 6, MEGTRON 7 and MEGTRON 8 product information and datasheets; application/context cross-checked against Panasonic public networking/5G materials. Panasonic and MEGTRON are trademarks of their respective owner. Refer to Panasonic's current datasheets for material specifications. Typical material data must be verified against the latest official datasheet and the actual approved PCB construction before release.