BGA Reballing
Request a review of BGA reballing with the exact package, device condition and replacement-ball specification. Define whether the work is on a removed device or part of a wider board-level rework order.
A defined reballing scope for your BGA device
BGA reballing replaces the solder-ball array on a device so it can be considered for another assembly operation. The package condition, alloy, ball geometry and previous handling all matter when deciding whether the work is suitable.
GlobalWellPCB reviews the supplied device and requested operation before an order is released. Include the fault history and the acceptance checks you need; reballing by itself does not establish that an IC is electrically good.
Separate ball replacement from removal and board installation.
Specify the exact ball map, dimensions and alloy.
Provide prior rework and failure information.
Define package checks and any later electrical test.
Choose the work your order needs
Device-only reballing
Review a removed BGA package for the requested ball-array restoration. Supply ball map, size, alloy and the known device history.
Removal, reballing and replacement
Discuss the complete board-level route when the device is still on the assembly. Include board condition, access and the intended replacement location.
Replacement-device comparison
If a device is damaged or its history is uncertain, compare reballing with fitting a new approved component. Keep the choice tied to repair purpose and verification needs.
How the project moves forward
- 01
Describe the device and problem
Provide MPN, photographs, history and the requested operation.
- 02
Review package suitability
Consider the condition, ball specification and board access where relevant.
- 03
Approve the rework scope
Agree handling, operations and the evidence needed for acceptance.
- 04
Complete the agreed work and checks
Identify the processed device or assembly and return the agreed inspection records.
What to send for a useful quotation
| File or requirement | Details to include |
|---|---|
| Device identity | Exact MPN and the quantity of devices or boards. |
| Condition photographs | Show the device, solder array or installed location clearly. |
| Requested operations | Identify device-only processing, removal, replacement or board installation. |
| Board context where applicable | Provide populated views and access restrictions for board-level work. |
| Package and ball-array data | Supply device MPN, ball map, diameter, pitch and required alloy. |
| Incoming history and test scope | Describe symptoms, removal or heat exposure and the procedure for verifying the final result. |
Include the quantity, current revision and required delivery date. If a decision is still open, identify it in your message so the review can address it.
Know what will be checked and returned
| Review area | What it covers | What to specify |
|---|---|---|
| Incoming package condition | Review physical condition and known prior processing. | Provide photographs and history before committing work. |
| Restored ball array | Check the array against the specified map and geometry. | Define package-level acceptance and identification. |
| Installed and functional result | Board joints and device operation need checks appropriate to the completed repair. | Request X-ray or electrical work separately as required. |
State any unit or batch identification, packaging and inspection or test records you need with delivery. The quotation confirms the operations and evidence included.
What shapes your quotation
A useful quotation describes the complete deliverable and its supply responsibilities. Include these items in the review so you can compare like-for-like scope.
- Device condition, package type and ball-array requirements.
- Device-only processing versus removal and board-level installation.
- Inspection, test fixtures, electrical verification and return packaging.
The delivery plan follows file readiness, approved materials and the requested operations. Share your target date and any items already available to help review the schedule.
Frequently asked questions
Is reballing the same as reflow?
No. Reflow reheats existing solder; reballing replaces the device ball array. Removal and installation are also separate operations.
Will reballing fix a faulty IC?
It cannot repair internal IC damage. Explain the symptoms and diagnosis so package work and electrical verification can be reviewed appropriately.
Can I send a device that is already removed?
Provide its identity, condition, ball specification and removal history, with suitable protective packaging.
What checks should follow installation?
Define hidden-joint inspection and the board or device functional tests needed for your repair. Appearance alone does not demonstrate operation.
Discuss your BGA Reballing requirements
Send the files, quantity and deliverable you need. Add your supply responsibilities, target date and any test or documentation requirements so the review covers the complete order.