BGA Assembly
Discuss BGA and micro-BGA assembly with a review of your package, PCB interface and hidden-joint inspection requirements. Send the board files, exact device details and test plan for a defined build.
BGA assembly with the package and inspection plan reviewed together
BGA packages place their solder connections beneath the device, so the board footprint, paste deposit and thermal process need to work together. Visible inspection alone cannot show all of the connections under the package.
GlobalWellPCB supports BGA assembly and reviews the board, package and inspection requirements as one scope. Include device data, population side and any critical signals or acceptance records required for your product.
Match the exact device to the footprint and assembly data.
Request the appropriate X-ray coverage before the build.
Keep sensitive device requirements and approved part identity with the BOM.
Provide programming and electrical checks before fixtures are planned.
Choose the work your order needs
BGA and micro-BGA devices
Review ball pitch, package dimensions and board interface using the exact component documentation. Tight geometry requires the actual design files for a manufacturing decision.
BGA on mixed or double-sided assemblies
Coordinate other SMT and through-hole parts with the BGA process. Identify thermal restrictions, heavy components and packages on both sides.
Inspection and board-level verification
Discuss X-ray coverage for hidden joints and the electrical or functional checks your design needs. Name the devices and connections that are critical to acceptance.
How the project moves forward
- 01
Provide the device and board files
Send package drawings, Gerber, BOM, CPL and populated-side views.
- 02
Review the BGA interface
Resolve footprint, paste, handling and thermal-process questions.
- 03
Agree inspection and testing
Define critical devices, acceptance criteria and required electrical checks.
- 04
Build and release the assembly
Assemble to the approved package and board revision, then deliver the agreed evidence.
What to send for a useful quotation
| File or requirement | Details to include |
|---|---|
| PCB fabrication files | Gerber and drill data, board construction and any panel requirements. |
| Component BOM | Exact manufacturer and MPN, quantity, fitted references and approved alternatives. |
| Placement file | CPL / pick-and-place data identifying X/Y, side, rotation and reference designator. |
| Assembly drawing | Polarity, DNP positions, mechanical details and special component instructions. |
| BGA package documentation | Include MPN, ball map, pitch, package drawing and handling information. |
| Inspection and test requirements | Identify critical BGAs, hidden-joint criteria, test access and required reports. |
Include the quantity, current revision and required delivery date. If a decision is still open, identify it in your message so the review can address it.
Know what will be checked and returned
| Review area | What it covers | What to specify |
|---|---|---|
| Package alignment and handling | Review orientation, package identity and assembly instructions. | Keep special device handling with the released files. |
| Hidden solder connections | Use X-ray within the agreed scope to evaluate concealed joints. | Define coverage and interpretation criteria by package. |
| Board operation | Use programmed and electrical checks where the order calls for them. | Provide fixtures, software and measurable acceptance limits. |
State any unit or batch identification, packaging and inspection or test records you need with delivery. The quotation confirms the operations and evidence included.
What shapes your quotation
A useful quotation describes the complete deliverable and its supply responsibilities. Include these items in the review so you can compare like-for-like scope.
- BGA count, package geometry, populated sides and the rest of the assembly.
- Board construction, stencil requirements and device handling.
- X-ray coverage, rework expectations and functional-test work.
The delivery plan follows file readiness, approved materials and the requested operations. Share your target date and any items already available to help review the schedule.
Frequently asked questions
What BGA information should I send?
The exact part number, ball map, pitch and package documentation, together with the board files and placement data. Include handling and inspection requirements.
Can AOI inspect the joints under a BGA?
AOI evaluates visible features. Hidden connections need another method such as X-ray; the required coverage and electrical checks are agreed separately.
Can BGAs be placed on both sides?
Send the actual design for sequence and support review. Component mass, package mix and thermal exposure affect the assembly route.
Is BGA replacement the same service?
Removal, replacement or reballing is a separate rework scope. Provide device condition and board history when requesting a review of existing hardware.
Discuss your BGA Assembly requirements
Send the files, quantity and deliverable you need. Add your supply responsibilities, target date and any test or documentation requirements so the review covers the complete order.