HTG hybrid with RO4450F
The 8L any-layer example records RO4450F + HTG hybrid pressing. HTG is a source description; specify the exact new-project grade.
Individual engineering example; the combination is reviewed for each project.
Engineering Reference
PCB Materials
Specify materials by exact product and construction, not by a broad family name alone. A useful material schedule identifies cores, bonding layers, copper, protective layers and any mechanical or electrical requirements that must remain fixed.
Capability register
Scope and conditions
Read each value together with its board type and review conditions.
- Exact gradeMaterial identity
- Core, prepreg and protective layers
- Written approvalSubstitution control
- Review before construction changes
Published limits apply to their stated board type. Layer count, copper weight and minimum geometry require a combined engineering review.
Capability register
What belongs in the material schedule
The capability table lists board families and protective options. Named laminate combinations below come from individual project references.
On smaller screens, scroll within the table to see every column.
| Parameter | Published capability | Applies to | Review conditions |
|---|---|---|---|
| Rigid laminate | Exact manufacturer and grade | Rigid cores | Thickness, copper and mandatory material properties |
| Bonding material | Exact prepreg / bond-layer identity | Multilayer and hybrid stackup | Ply/finished thickness requirements and compatibility review |
| Flexible construction | PI / protection and adhesive details | Flex and rigid-flex regions | Flexible thickness, openings, stiffeners and intended bend duty |
| Copper | Layer-specific requirement | Core foil and finished circuit | State finished copper and any mandatory foil specification |
| Metal base and thermal dielectric | Exact construction to be agreed | Aluminum/copper metal-based board | Base thickness, insulation and thermal-property requirements |
| Substitutions | Subject to approved material schedule | Any proposed alternate | Review design properties, dimensions and process implications before release |
Documented project examples
Named materials in documented examples
These examples describe individual structures in our project reference material. They do not establish a general maximum or guarantee the same combination for a new design.
ITEQ IT968 reference
A 6L chip-testing-board example names ITEQ IT968. This is an example material identity, not a stock or availability statement.
Individual engineering example; the combination is reviewed for each project.
Rogers4835 + Isola370HR
A 6L reference combines these named materials with blind vias.
Individual engineering example; the combination is reviewed for each project.
Rogers4350B + 4450F
A 12L, 3.0mm example records this material combination.
Individual engineering example; the combination is reviewed for each project.
RO4003C + HTG
A 14L example records this hybrid along with blind spans and backdrill.
Individual engineering example; the combination is reviewed for each project.
Taconic TSM-DS3 + FR4 HTG
An 8L example records this hybrid with blind spans and a plated gold edge.
Individual engineering example; the combination is reviewed for each project.
Engineering review
Specify properties with their test conditions
A material family name does not define every value used in a design model.
- Electrical design
- Where Dk, Df or another electrical property is mandatory, identify the relevant manufacturer document and test condition. State whether the exact grade is fixed.
- Thermal and processing needs
- Provide temperature and assembly constraints that drive material selection. For metal-core work, identify the required thermal dielectric and electrical isolation criteria.
- Mechanical requirements
- Specify core and bond-layer thickness needs, finished thickness, flexible duty and any flatness or dimensional requirement that affects the product.
Engineering review
Flexible materials need regional definitions
Protection and reinforcement must be located on the drawing.
The flex sheet lists green solder mask and black, yellow or white PI options. Confirm the chosen protective construction and its openings rather than treating every listed entry as interchangeable.
For rigid-flex, identify which material continues through the flexible region and where rigid material, protection, adhesive and stiffeners end. Supply a region drawing and the intended installed shape.
Engineering review
Control a material change as a design decision
Compare the complete construction before approving an alternate.
A proposed substitute should name the exact product and show which thickness, copper, bonding and required properties change. Engineering can then review the effect on the stackup, impedance, drilling and assembly requirements.
Record the approved revision of the material schedule with the fabrication release. If the original material is mandatory, state that clearly in the RFQ and drawing.
Engineering handoff
Send a material-led RFQ
Attach the construction rather than a brand list.
Material review
Send the material schedule, stackup, required properties and test conditions, fabrication data and substitution policy.
View capabilityHybrid construction
See how the material identity connects to signal and via requirements.
View capabilityRFQ checklist
Send the files that define your build
Include the drawing revision and acceptance requirements. The engineering review confirms the manufacturable combination before quotation.
PCB fabrication
- Gerber or ODB++ fabrication data and the board outline
- Layer stackup, material identity, finished copper and board thickness
- Drill data, impedance targets, surface finish and inspection requirements
PCB assembly
- PCB fabrication package and an itemized BOM with manufacturer part numbers
- CPL / pick-and-place data, assembly drawings and component polarity
- Component sourcing scope, programming files and the agreed test procedure
Engineering FAQ
Questions before you quote
Does a named material example mean it is currently stocked?
No. Examples document particular material combinations. Availability and the accepted construction for a new order are confirmed during quotation.
Is HTG enough information for a new board?
Use it as a requirement description, then identify the exact manufacturer, grade, thickness and properties that the released stackup must meet.
How should I approve a material substitute?
Review the exact alternate grade with its material documentation and the proposed stackup. Record approval for changes that affect required properties, geometry or processing.
Should I provide prepreg details as well as the core?
Yes, where the design controls them. Bonding layers contribute to the released construction, thickness and impedance review.