PCBA Quote
Attach PCB fabrication files, BOM, CPL/pick-and-place, assembly drawing and sourcing instructions. Add test/programming requirements and the required delivery records.
View capabilityAssembly & Verification
PCB Assembly Capabilities
Build a reviewable assembly package around the actual PCB revision, component packages and acceptance criteria. Fine-pitch capability depends on the land pattern, component condition, board support, access and inspection plan.
Capability register
Scope and conditions
Read each value together with its board type and review conditions.
- 01005Minimum chip size
- Package and land-pattern review
- 0.2mmBGA / Micro BGA pitch
- Published entry; ball count >1000
- SMT / PTHAssembly methods
- Single and double sided
Published limits apply to their stated board type. Layer count, copper weight and minimum geometry require a combined engineering review.
Capability register
Assembly capability register
Each entry describes the stated feature. Package, board and inspection requirements must be assessed as a complete assembly.
On smaller screens, scroll within the table to see every column.
| Parameter | Published capability | Applies to | Review conditions |
|---|---|---|---|
| Assembly methods | Single and double sided SMT/PTH | Assembly list | BOM technology mix, side sequence and component access |
| Large parts / BGA on both sides | Listed | Double sided assembly | Board support, component height and process sequence |
| Minimum chip size | 01005 | Chip components | Package, land pattern, paste, handling and inspection |
| BGA / Micro BGA | 0.2mm pitch; ball count greater than 1000 | Corporate BGA entry | Package drawing, land pattern, board structure and inspection |
| Minimum leaded-part pitch | 0.2mm | Leaded package entry | Lead/land geometry, component condition and soldering method |
| Maximum machine-assembled part | 2.2 × 2.2 × 0.6inch | Machine assembly entry | Package handling, weight, nozzle/access and board support |
| Maximum PCB size | 14.5 × 19.5inch | Assembly handling entry | Panel, rails, component overhang and fixture needs |
| Wave soldering | Listed | Applicable through-hole process | Component suitability, keepouts and tooling requirements |
Engineering review
Define the component and sourcing scope
Part identity is part of the assembly instruction.
- BOM control
- Supply manufacturer and exact part number, reference designators, quantity per assembly and fitted/not-fitted status. Mark alternates and substitutions that need approval.
- Supplied components
- Identify customer-supplied lines, packaging and any handling instructions. Match package variants to the land pattern and placement data.
- Special parts
- The capability list includes surface-mount connectors, resistor/capacitor networks, electrolytic capacitors, variable parts and sockets. Flag unusual geometry, polarity or manual operations.
Capability register
Panel, placement and board support
Panelization must support the assembly and the final separation method.
On smaller screens, scroll within the table to see every column.
| Parameter | Published capability | Applies to | Review conditions |
|---|---|---|---|
| Panel methods | Tab routed; breakaway tabs; V-scored; routed + V-scored | Assembly list | Finished outline, separation keepout and mechanical stress requirements |
| Fiducial marks | Preferred | Placement alignment | Define fiducials, local fine-pitch targets and tooling access |
| Board shape | Reviewed from outline | Fabrication and assembly interface | Irregular outlines, overhangs and support need explicit review |
| Placement data | CPL / pick-and-place plus drawing | Populated sides | Units, origin, side, rotation and revision must agree |
Engineering review
Choose the inspection and test scope
The method must fit the feature being accepted.
The capability list includes X-ray analysis, microscopy to 20X and 100% AOI testing. Agree AOI coverage, hidden-joint review and the records required for your package mix.
If ICT, programming or functional test is required, supply the test specification, access, firmware, fixture/interface and pass criteria. These operations and their coverage are confirmed for the project.
Capability register
Rework capability and release decisions
Rework is reviewed against the board, component and acceptance requirements; listing a station does not approve every repair.
On smaller screens, scroll within the table to see every column.
| Parameter | Published capability | Applies to | Review conditions |
|---|---|---|---|
| BGA removal and replacement | Station listed | BGA rework | Package, board history, nearby parts and inspection |
| SMT IR rework | Station listed | Surface-mount rework | Thermal sensitivity, access and agreed process |
| Through-hole rework | Station listed | Through-hole joints | Hole/pad condition, component access and acceptance |
Engineering handoff
Send a complete assembly package
Use the central quote form and select or describe PCB assembly in the request.
Inspection planning
Review optical, hidden-joint and functional coverage before assembly release.
View capabilityRFQ checklist
Send the files that define your build
Include the drawing revision and acceptance requirements. The engineering review confirms the manufacturable combination before quotation.
PCB fabrication
- Gerber or ODB++ fabrication data and the board outline
- Layer stackup, material identity, finished copper and board thickness
- Drill data, impedance targets, surface finish and inspection requirements
PCB assembly
- PCB fabrication package and an itemized BOM with manufacturer part numbers
- CPL / pick-and-place data, assembly drawings and component polarity
- Component sourcing scope, programming files and the agreed test procedure
Engineering FAQ
Questions before you quote
What information is needed for 01005 components?
Include the exact manufacturer part number and package drawing, matched to the BOM and land pattern. The board support, solder-paste process, handling and inspection plan are reviewed with the complete assembly.
Can the BGA pitch entry be applied to every package?
No. Supply the exact package drawing, land pattern, ball map and board construction. The published entry is 0.2mm pitch with a ball-count entry greater than 1000.
What must match between the BOM and CPL?
Reference designators, fitted status, board revision, populated side and package must agree. State placement units, origin and rotation convention.
Are ICT and FCT automatically included?
Their method, fixtures, access, software and coverage are confirmed for the project. Provide the test specification and pass criteria during the RFQ.