Rigid PCB
Up to 68L, with separate inner and outer geometry, copper, thickness and drill conditions.
View capabilityManufacturing capability center
PCB & PCBA Manufacturing Capabilities
Start with the board or assembly your design needs, then check the specification, its scope and the files required for engineering review. Published limits describe individual capabilities; the stackup, copper, geometry and verification plan must work together.
Capability register
Scope and conditions
Read each value together with its board type and review conditions.
- 68LRigid PCB layers
- Rigid boards; stackup review required
- 85ozFinished copper
- Rigid inner and outer layers; reviewed separately
- 8LFlex PCB layers
- Flexible construction
- 36LRigid-flex layers
- Total rigid-flex construction
- 01005Minimum chip size
- Assembly; land pattern and inspection review
Published limits apply to their stated board type. Layer count, copper weight and minimum geometry require a combined engineering review.
Explore capabilities
Find the right capability
Choose a technical scope before comparing individual limits.
Flex PCB
Up to 8L; confirm flexible thickness, copper, PI protection, stiffeners and bend requirements.
View capabilityRigid-Flex PCB
Up to 36L; define rigid zones, flex layers, transitions and the installed shape.
View capabilityHDI & Microvias
Laser microvias, blind and buried structures and a documented any-layer example; construction is reviewed from a via map.
View capabilityRF & High-Speed PCB
Material identity, hybrid stackups, impedance requirements and controlled via transitions.
View capabilityHeavy Copper & Metal-Core
Two different design routes: copper for current paths and a metal base for the thermal structure.
View capabilityPCB Assembly
Single and double sided SMT/PTH, fine-pitch packages, panel handling and rework review.
View capabilityInspection & Testing
Keep bare-board verification, assembled-board inspection and functional test requirements explicit.
View capabilityAt a glance
Compare the manufacturing scope
Use the comparison to select a review path. A value in one column does not transfer to another construction.
On smaller screens, scroll within the table to see every column.
| Scope | Published reference | Key design dependency | RFQ package |
|---|---|---|---|
| Rigid PCB | 68L; 0.4–11.5mm board thickness | Copper, hole aspect ratio and stackup | Gerber/ODB++ or equivalent fabrication data, drill files and drawing |
| Flex PCB | 8L; 0.1–0.5mm board thickness | Bend zone, copper and stiffener boundaries | Fabrication data, flex stackup and bend/installation drawing |
| Rigid-flex PCB | 36L; 0.4–8mm board thickness | Layer count by region and rigid-flex transition | Region stackup, via map and installed assembly drawing |
| PCB assembly | 01005; BGA/Micro BGA 0.2mm pitch entry | Land pattern, component package, access and inspection | PCB data, BOM, CPL/pick-and-place and assembly drawing |
Explore capabilities
Resolve the engineering details
These references connect the capability table to the drawing and acceptance requirements.
PCB Materials
Identify the exact core, prepreg and flexible material. Review substitutions before fabrication.
View capabilityStackup & Impedance
Define layer order, dielectric thickness, reference planes and impedance acceptance.
View capabilityDrilling & Via Structures
Specify finished holes, layer spans, via filling, backdrill and mechanical features.
View capabilitySurface Finishes
Select the finish by assembly, contact and handling requirements; identify local areas on the drawing.
View capabilityDocumented project examples
Examples of combined engineering requirements
These examples describe individual structures in our project reference material. They do not establish a general maximum or guarantee the same combination for a new design.
Multilayer with impedance
A 28L HTG reference combines 3.65mm thickness, 15:1 aspect ratio and impedance control. It is a project example, separate from the general rigid limits.
Individual engineering example; the combination is reviewed for each project.
Rigid-flex interconnect
A 10L rigid-flex reference includes two flex layers and impedance in the flex area.
Individual engineering example; the combination is reviewed for each project.
Hybrid RF structure
A 6L reference combines Rogers4835 and Isola370HR with blind vias. Exact material identity and bonding details remain part of a new project review.
Individual engineering example; the combination is reviewed for each project.
Engineering review
Agree verification before release
Inspection answers a defined question; it should be specified alongside the product files.
- Bare board
- Define electrical continuity/isolation checks, controlled-impedance evidence and any cross-section or dimensional records required for the board.
- Assembled board
- The capability list includes X-ray analysis, microscopy to 20X and 100% AOI testing. Confirm the quoted coverage and records for your assembly.
- Functional acceptance
- Supply a test specification, firmware and fixture requirements where ICT or FCT is requested. Their availability and coverage are confirmed for the project.
Explore capabilities
Send the right files for review
Use the central quote form and identify PCB fabrication or PCB assembly in the request.
PCB Quote
Send fabrication and drill data, the drawing, stackup, quantity and any controlled features. Identify the design revision.
View capabilityPCBA Quote
Add the BOM, CPL/pick-and-place, assembly drawing, sourcing instructions and test requirements to the PCB package.
View capabilityEngineering review
Read a limit with its conditions
Maximum layer count, maximum copper and minimum geometry are separate statements.
A design at one limit can change the usable range of another feature. Engineering review reconciles copper thickness with trace/space, hole depth with diameter, and material choice with lamination and impedance.
For quotation, identify the requirements that are essential and those that may be adjusted. A documented stackup and explicit acceptance criteria make that decision traceable.
RFQ checklist
Send the files that define your build
Include the drawing revision and acceptance requirements. The engineering review confirms the manufacturable combination before quotation.
PCB fabrication
- Gerber or ODB++ fabrication data and the board outline
- Layer stackup, material identity, finished copper and board thickness
- Drill data, impedance targets, surface finish and inspection requirements
PCB assembly
- PCB fabrication package and an itemized BOM with manufacturer part numbers
- CPL / pick-and-place data, assembly drawings and component polarity
- Component sourcing scope, programming files and the agreed test procedure
Engineering FAQ
Questions before you quote
Can the maximum layer count, copper thickness and minimum trace/space be combined?
They are separate published limits. Submit the actual layer construction, finished copper and geometry so engineering can assess the combination.
Should I request PCB fabrication or PCB assembly?
Choose PCB fabrication for bare boards. For assembled boards, include the fabrication data plus BOM, CPL/pick-and-place, assembly instructions and the required test scope.
Does an example establish the limit for every new project?
No. The examples document particular constructions. A new design needs its own material, stackup, via and acceptance review.