Advanced PCB Manufacturing Services
Get bare PCBs for prototypes and production, with support for materials, stackups and design questions before fabrication. Send your files to discuss the board construction and inspection your project needs.
Send the Data That Defines Your PCB Build.
Share your fabrication data, construction requirements and critical features for a manufacturing review.
Package Gerber or ODB++ and drill files in a ZIP; add the stackup and fabrication drawing.
You can describe the requirements even if your files are still being prepared. Include quantities and target dates in your notes, if available.
Project enquiry
Add your contact details, requirements and available files.
Need an NDA? Contact us before uploading confidential design files.
A manufacturing route built around your design requirements.
PCB sourcing decisions depend on more than board type. Material behavior, stackup, copper distribution, hole structure, surface finish and inspection scope must work together. GlobalWellPCB reviews these inputs as one manufacturing package before production release.
Find the board type that fits your design, then send your fabrication files and requirements for a quotation.
Prototype & Production
Plan early builds and later production requirements through one documented technical path.
DFM Review
Identify file, stackup, spacing and process risks before the board enters fabrication.
Material Alignment
Confirm the substrate and finish against electrical, thermal and assembly needs.
Verification Scope
Define inspection, electrical test and reporting requirements for the specific project.
PCB Fabrication
PCB Manufacturing
Capabilities
Explore our PCB fabrication specifications, material options and inspection methods for your next project.
| Parameter | Manufacturing Capability |
|---|---|
| PCB Types | Rigid, flexible and rigid-flex PCBs; HDI, high-frequency, controlled-impedance and metal-core constructions. |
| Layer Count | Rigid PCB: up to 68 layersFlex PCB: up to 8 layersRigid-flex PCB: up to 36 layers |
| Board Thickness | Rigid PCB: 0.4–11.5 mmFlex PCB: 0.1–0.5 mmRigid-flex PCB: 0.4–8.0 mmFor boards below 1.0 mm: rigid / rigid-flex ±0.08 mm; flex ±0.05 mm. |
| Board Dimensions | Finished board size and panel format are confirmed from your board outline and panel requirements. |
| Copper Thickness | Rigid PCB: up to 85 oz, inner and outer layersFlex PCB: up to 2 oz, inner and outer layersRigid-flex PCB: up to 6 oz inner / 3 oz outer |
| Trace Width / Spacing | Rigid PCB inner layers: 2.5 / 2.5 mil minimumRigid PCB outer layers: 3 / 3 mil minimumMinimum features depend on copper weight and the selected stackup. |
| Drilling & Via Structures | Rigid PCB mechanical drilling: down to 0.10 mmRigid PCB laser drilling: down to 0.075 mmBlind / buried vias, via-in-pad and backdrilling. Via filling and plating requirements are confirmed per project. |
| Materials | FR-4, high-Tg, RF and low-loss laminates; flexible laminates and aluminium- / copper-base materials.Specify the laminate family, grade and acceptable alternatives. |
| Surface Finishes | Lead-free HASL, ENIG, hard gold, ENEPIG, OSP, immersion tin and immersion silver. |
| Controlled Impedance | Rigid PCB: ±5 Ω at ≤50 Ω; ±7% above 50 ΩFlex / rigid-flex: ±5 Ω at ≤50 Ω; ±10% above 50 ΩSingle-ended or differential. Confirm the stackup, test coupon and measurement scope. |
| Inspection & Testing | AOI, electrical and flying-probe testing; visual and dimensional inspection.Test coverage, X-Ray applicability and required reports are agreed for the project. |
Capability limits depend on board construction, materials and the selected process combination. Layer count, copper weight and minimum features are reviewed together for each build.
Ready to Discuss Your PCB Project?
Send your Gerber files, drill data, order quantity and fabrication requirements. Include any specified materials, impedance targets or inspection requirements.
Explore PCB Solutions for Your Needs
Explore PCB types by material, construction and design needs, with guidance on the files to send for a quote.
Multilayer PCB
Stackup planning, lamination, impedance and interlayer registration for complex rigid boards.
HDI PCB
Microvias, blind and buried vias, via-in-pad and dense interconnect structures.
Heavy Copper PCB
Copper distribution, etching allowances and thermal paths for high-current designs.
High-Frequency PCB
Low-loss materials, controlled impedance and hybrid construction for RF and microwave designs.
Flexible PCB
Polyimide circuits with coverlay, stiffeners and bend-area considerations.
Rigid-Flex PCB
Rigid and flexible sections coordinated through one stackup and transition design.
Metal-Core PCB
Aluminum or copper-base constructions designed around insulation and thermal transfer.
PCB Prototype
Fabrication support for engineering validation before the design moves toward production.
What to include for each board construction.
Use these illustrated board types to check the additional files and requirements needed for your RFQ. The images illustrate construction categories and do not identify customer projects.
HDI PCB
RF & Microwave PCB
Rigid-Flex PCB
Heavy Copper PCB
Metal-Core PCB
Multilayer PCB
Organize complexity by its manufacturing risk.
Choose a technology below to review the design inputs and manufacturing considerations for your board.
HDI & Microvia Structures
Coordinate via type, sequential build-up, capture pads, plating and reliability requirements.
- Review laser microvia and blind/buried-via definitions.
- Confirm via-in-pad filling and surface requirements.
- Provide stackup and interconnect intent with the RFQ.
High-Frequency & Low-Loss PCB
Align laminate selection, copper profile, stackup and impedance with signal-performance needs.
- Identify the required material or electrical target.
- Document controlled-impedance structures.
- Review hybrid-lamination and mechanical constraints.
Heavy Copper & High-Current PCB
Balance copper weight, conductor geometry, hole copper and heat flow across the finished board.
- Share current and thermal design requirements.
- Review etching allowances and spacing.
- Confirm terminals, slots and mechanical interfaces.
Flex & Rigid-Flex Construction
Define rigid, flexible and transition zones as one manufacturable stackup.
- Mark dynamic and static bend regions.
- Specify coverlay, stiffener and shielding needs.
- Review conductor routing through transition areas.
PCB Materials &
Surface Finishes
The board material forms the base of your PCB. The surface finish protects exposed copper pads and supports assembly or electrical contact.
PCB Materials
Choose the base material for your signal, temperature, flexibility and heat-management needs.
| Material | Typical Use & Options |
|---|---|
| Standard FR-4 | General-purpose rigid PCBs for control, industrial and consumer electronics. |
| High-Tg FR-4 | Projects with higher assembly-temperature requirements. Confirm the grade against the board's thermal requirements. |
| RF & High-Speed Laminates | RF, microwave or high-speed designs. Options include Rogers, Taconic, Arlon, Nelco, Isola, Megtron and PTFE; confirm the required grade. |
| Polyimide Flex Materials | Flexible circuits and the flexible areas of rigid-flex boards. |
| Metal-Core Materials | Aluminum- or copper-base boards for LED lighting, power electronics and heat-management needs. |
Surface Finishes
Choose the finish on exposed copper pads for soldering, wire bonding or contact wear.
| Surface Finish | Typical Use |
|---|---|
| Lead-Free HASLHot Air Solder Leveling | General soldered assemblies; review suitability when pad flatness is critical. |
| ENIGElectroless Nickel / Immersion Gold | A flat surface for fine-pitch pads and soldered components. |
| Hard GoldElectroplated Gold | Gold fingers and contacts that need resistance to repeated wear. |
| ENEPIGElectroless Nickel / Electroless Palladium / Immersion Gold | Soldering and wire-bonding projects; confirm the bonding process before selection. |
| OSPOrganic Solderability Preservative | An organic coating that preserves copper solderability. Review assembly cycles and handling. |
| Immersion Tin | A flat tin surface for soldered assemblies; review assembly and storage requirements. |
| Immersion Silver | A flat silver surface for soldered assemblies; review handling and storage conditions. |
Exact laminate grades and finish specifications are confirmed for your board design and assembly requirements.
Need Help Choosing a Material or Finish?
Send your board files, operating requirements and assembly details. Include a preferred material or finish if you have one.
PCB Prototype
to Production
Follow the key steps from design-file review and prototype evaluation to production release and shipment preparation.
| Stage | What Happens |
|---|---|
| 01RFQ & Design Files | Send fabrication data, drawings, quantity and critical technical requirements. |
| 02Engineering Review | Review manufacturability, stackup, materials, vias and impedance requirements. |
| 03Prototype Build | Build the agreed prototype configuration for technical evaluation. |
| 04Prototype Verification | Complete the agreed inspection and electrical testing for the prototype. |
| 05Sample Review | Record sample approval, observations and any required design changes. |
| 06Production Release | Confirm the production file revision, approved changes and manufacturing requirements. |
| 07Final Inspection | Check the completed production lot against the agreed documentation and test scope. |
| 08Delivery Preparation | Prepare the finished boards and agreed project records for shipment. |
The exact route and inspection scope depend on the board design and agreed project requirements.
Start with Your PCB Design Files
Send your fabrication data, drawings, quantity and critical requirements to begin the project review.
A controlled path from material preparation to final inspection.
The exact route varies with the board construction. These stages provide a clear overview without replacing the project traveler or approved process documentation.
PCB Production in Pictures
Selected fabrication and inspection stages from sheet cutting to electrical testing. The production route varies with the approved board construction.
Sheet Cutting · Imaging · Lamination
Drilling · Plating · AOI
Solder Mask · Legend · Surface Treatment
CNC Routing · V-Cut · Electrical Test / TDR
Align inspection and testing with your board requirements.
Discuss inspection methods, test coverage and reporting requirements for your PCB project.
- DFM and file reviewCheck construction and documentation before production release.
- In-process inspectionApply inspection at the stages defined by the manufacturing route.
- AOIReview patterned layers for relevant visual defects.
- Electrical testingConfirm the project-specific continuity and isolation test scope.
- Final inspectionReview dimensions, workmanship and agreed documentation before shipment.
Review the board against its operating environment.
Explore board requirements for your application. Include any industry qualification or supplier-approval requirements with your enquiry.
Telecommunications
Signal integrity, low-loss materials, stackup and impedance requirements.
Industrial Electronics
Construction, temperature, power and service-environment considerations.
Power Electronics
Copper weight, current paths, spacing and thermal-management needs.
Automotive Electronics
Project-specific material, reliability, documentation and validation requirements.
Medical Electronics
Documentation, traceability and verification requirements defined by the customer.
Aerospace & RF Systems
Special materials, RF performance and project-specific acceptance requirements.
Consumer Electronics
Compact structures, form-factor constraints and production transition planning.
Robotics & Automation
Mixed signal, control, power and mechanical-interface considerations.
Prepare a clearer PCB manufacturing package.
Find guidance on materials, stackups, tolerances and manufacturing files before requesting a PCB quote.
Before requesting a PCB quote.
Find answers about quotation files, material selection, testing and delivery planning.
What files are required for a PCB quotation?
Provide Gerber or ODB++ fabrication data, NC drill files, a board outline and available drawings. Include quantities, material, thickness, copper weight, surface finish, impedance and test requirements where applicable.
What information is needed for an HDI PCB?
Include the complete stackup, microvia and blind/buried-via definitions, sequential build-up intent, via-in-pad requirements and any controlled-impedance structures.
How should controlled impedance be specified?
Identify each impedance target, tolerance, referenced layers and trace structures. Share the proposed stackup when available so material and geometry can be reviewed together.
Which PCB materials are available?
The page groups common FR-4, high-Tg, RF, flexible, metal-core and ceramic material families. Exact grades and availability must be confirmed against the approved material list for the project.
Which surface finish should be selected?
The choice depends on assembly, flatness, contact wear, storage, wire bonding and signal requirements. Share the end-use conditions so the options can be reviewed.
Can prototype and production requirements be reviewed together?
Yes. Providing both quantity stages and the intended production requirements helps keep prototype decisions aligned with later releases, subject to project review.
What testing options are available?
Testing is confirmed for each project. The review should define electrical-test coverage, inspection stages, reporting needs and any additional verification required by the customer.
How are special materials and complex stackups evaluated?
Engineering review considers the laminate, copper, finished thickness, lamination route, hole structure, impedance and mechanical requirements as one construction.